Electroless plating deposits metal by chemical reduction rather than applied current — so the coating follows the surface, not the current path.
For a part with bores, threads or blind recesses that is the whole argument: uniform thickness everywhere, including where an anode cannot see.
What we supply
Sodium Hypophosphite, Copper (II) Sulphate, Nickel (II) Chloride Hexahydrate, Stannous Chloride and Sodium Molybdate.
What we supply
Sodium HypophosphiteCopper (II) SulphateStannous ChlorideSodium MolybdateNickel (II) Chloride Hexahydrate Purified
Sodium Hypophosphite The reducing agent behind electroless nickel. It deposits nickel-phosphorus autocatalytically — no current, and therefore an even thickness over complex geometry that electroplating cannot reach.
Why electroless at all An electroplated deposit follows the current, so it thickens on edges and thins in recesses. An electroless deposit follows the surface, which is what internal bores and threads need.
Bath salts Copper sulphate and nickel chloride supply the metal; stannous chloride handles sensitising and activation ahead of deposition on non-conductive substrates.
Bath control Metal, reducer and pH deplete as the bath works, and deposit quality tracks that balance. Consistent input chemistry is what makes a bath controllable.
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